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DIY For Audio
The relative advantages of lugs and solder... A study in connectivity
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<blockquote data-quote="Hennie" data-source="post: 86171" data-attributes="member: 20"><p>For high current applications yes, indeed. In high current density applications lead / tin alloys are not very reliable due to eletrochemical migration (ECM). This is one reason why crimp connections are often used in high current applications. But lead free tin alloys are also more reliable than lead / tin here, as are lead / tin with silver added (%Ag > 4%). These high silver content solders were originally developed to address ECM. </p><p></p><p>Another solution to improve reliability in lead tin solder joints is to just keep the current density low and let ECM occur at a low enough rate so as not to be the limiting factor in equipment reliability.</p><p></p><p>So many solder joint failures in television sets are due to too high current densities.</p></blockquote><p></p>
[QUOTE="Hennie, post: 86171, member: 20"] For high current applications yes, indeed. In high current density applications lead / tin alloys are not very reliable due to eletrochemical migration (ECM). This is one reason why crimp connections are often used in high current applications. But lead free tin alloys are also more reliable than lead / tin here, as are lead / tin with silver added (%Ag > 4%). These high silver content solders were originally developed to address ECM. Another solution to improve reliability in lead tin solder joints is to just keep the current density low and let ECM occur at a low enough rate so as not to be the limiting factor in equipment reliability. So many solder joint failures in television sets are due to too high current densities. [/QUOTE]
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DIY & Tutorials
DIY For Audio
The relative advantages of lugs and solder... A study in connectivity
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